XiC Products

XiC Corp. is a technology company specializing in developing and manufacturing advanced XiC™ crystal-based heating, vacuum, and bonding tools and components for use in semiconductor packaging, chip bonding, and related precision applications.

Pulse Heater [Rapid Heater Element]

Overview: High-speed heating element used in semiconductor chip packaging and TC bonding
Heating Element: XiC Direct heating
Spec: To be announced
Application: Flip Chip Bonding, HBM (TSV) Bonding, ACF Bonding
XiC Technology (patents): 3 fields, 8 items

Heater Vacuum Plate [P&P Bonding Tool]

Overview: Pick & Place bonding tool for vacuum adsorption of semiconductor chips (Also a consumable part paired with the Pulse Heater)
Material &: XiC & Static Dissipative / Antistatic
Spec: Hardness: 3000 Hv, Thermal conductivity: 310–460 W/m·K, Sheet resistance: 1E6–1E9 Ω
Application: Flip Chip Bonding, HBM (TSV) Bonding
XiC Technology (patents): 2 fields, 5 items

Coining Head [Bump Flatten Tool]

Overview: Tool for pressure-flattening bumps on chip substrates
Material &: XiC & Surface Enhancement
Spec: Hardness: 3000 Hv, Compression strength: 52 GPa, Flatness: 1 µm / 90 mm², Surface roughness: Ra ≤ 1 nm
Application: Flip Chip Bonding, HBM (TSV) Bonding
XiC Technology (patents): 2 fields, 4 items

XiC™ Crystal Application

Overview: Various application products using XiC Crystal
Examples: Nozzle, Pin, Disk
Material &: XiC &
Spec: Depends on application
XiC Technology (patents): In progress

Get in touch with us!

585-678-1002

Phone

sales@landmarkmeasurement.com

Address

Landmark Measurement Solutions Inc.